Printed circuit board assemblies with engineered thermal paths and methods of manufacture

A method for forming a printed circuit board having an engineered thermal path, the method comprising:

• forming a first cavity in a top surface of the printed circuit board;
• filling the first cavity with a first thermal conductive material;
• forming a second cavity in a bottom surface of the printed circuit board, wherein the first cavity is in thermal communication, electrical communication, or both thermal and electrical communication with the second cavity to form a filled cavity structure as an engineered thermal path, an electrical path, or both;
• and,
• filling the second cavity with a second thermal conductive material.

A method for forming a printed circuit board having an engineered thermal path, the method comprising:

• forming a first cavity in a top surface of the printed circuit board (PCB);
• panel plating the PCB and the first cavity;
• forming a second cavity in a bottom surface of the printed circuit board;
• applying a photoresist mask to the PCB to expose the first cavity and the second cavity;
• and
• simultaneously plating to fill the first cavity and the second cavity with a thermal conductive material, wherein the first cavity is in thermal communication, electrical communication, or both thermal and electrical communication with the second cavity to form a filled cavity structure as an engineered thermal path, an electrical path, or both.