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US 2021/0243879 A1Published application
Printed-circuit board
AssigneeNippon Mektron, Ltd.
InventorsKenji KIYA, Tomoki KANAYAMA
Life of this patent
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Abstract
A printed-circuit board includes: a film-shaped thermoplastic base member having plasticity; a pattern fuse formed from a metal foil layer provided on a principal surface of the base member; a cover member covering at least part of the pattern fuse from an opposite side of the base member; and a first heat-resistant protection film provided on a region overlapping with at least part of the pattern fuse and covering the pattern fuse from a cover member side.
Claims9
A printed-circuit board comprising:
- a film-shaped thermoplastic base member having plasticity;
- a pattern fuse formed from a metal foil layer provided on a principal surface of the base member;
- a cover member covering at least part of the pattern fuse from an opposite side of the base member;
- and
- a first heat-resistant protection film provided on a region overlapping with at least part of the pattern fuse and covering the pattern fuse from a cover member side.
2 more elements
Dependencies are inferred from the claim text.