Packaging method and packaging structure of film bulk acoustic resonator

A packaging method of a film bulk acoustic resonator, comprising:

• providing a resonant cavity main structure, wherein the resonant cavity main structure includes a first substrate and a film bulk acoustic resonant structure formed on the first substrate, wherein a first cavity is formed between the first substrate and the film bulk acoustic resonant structure;
• forming a resonator cover by providing a second substrate and forming an elastic bonding material layer on the second substrate, wherein the elastic bonding material layer contains a second cavity and an initial opening on a periphery of the second cavity;
• bonding the resonant cavity main structure and the resonator cover together through the elastic bonding material layer and removing elasticity of the elastic bonding material layer, wherein after the bonding process, the film bulk acoustic resonant structure is sandwiched between the first substrate and the second substrate, the second cavity is at least partially aligned with the first cavity, and the initial opening exposes a corresponding electrical connection part of the film bulk acoustic resonant structure;
• forming a through-hole containing the initial opening and a hole connected with the initial opening and passing through the resonator cover;
• and
• forming a conductive interconnection layer, wherein the conductive interconnection layer covers a sidewall of the through-hole and a portion of a surface of the resonator cover on a periphery of the through-hole.