High-Bandwidth Antenna In Package Apparatus

A terminal device, comprising an antenna-in-package apparatus, wherein the antenna-in-package apparatus comprises:

• a first radiator;
• a second radiator;
• a first substrate;
• a second substrate;
• a first metal piece;
• and
• a first feeding path, wherein the first radiator and the first feeding path are disposed on the first substrate, wherein the second radiator is disposed on the second substrate, wherein the first feeding path is configured to feed the first radiator, and wherein the second radiator and the first radiator are connected by the first metal piece.

An antenna-in-package apparatus, comprising:

• a first radiator;
• a first substrate;
• a first metal piece;
• and
• a first feeding path, wherein the first radiator and the first feeding path are disposed on the first substrate, wherein the first metal piece is configured to connect the first radiator and a second radiator, wherein the second radiator is disposed on a second substrate, wherein the second substrate is disposed on a side of the first metal piece of the first substrate, and wherein the first feeding path is configured to feed the first radiator.