Method for manufacturing printed electronic device using multi-passivation and printed electronic device

Abstract

The present disclosure relates to a method for manufacturing a printed electronic device using multi-passivation and the printed electronic device. The method for manufacturing a printed electronic device using multi-passivation includes printing a printed electronic device including a gate electrode, a dielectric layer, a semiconductor layer, a source electrode and a drain electrode; and printing a multi-passivation layer of a multi-layer structure for passivating the printed electronic device by using amorphous fluoropolymer.

Dependencies are inferred from the claim text.