Memory device and programming method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChao-I Wu
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChao-I Wu
Estimating the term…
A memory device and a programming method of the memory device are provided. The memory device includes a bottom electrode, a heater, a phase change layer and a top electrode. The heater is disposed on the bottom electrode, and includes heat conducting materials different from one another in terms of electrical resistivity. A first one of the heat conducting materials has a periphery wall portion and a bottom plate portion connected to and surrounded by the periphery wall portion. A second one of the heat conducting materials is disposed on the bottom plate portion of the first one of the heat conducting materials, and laterally surrounded by the periphery wall portion of the first one of the heat conducting materials. The phase change layer is disposed on the heater and in contact with the heat conducting materials. The top electrode is disposed on the phase change layer.
A memory device, comprising:
A memory device, comprising:
A programming method of a memory device, wherein the memory device comprises a bottom electrode, a heater disposed on the bottom electrode and having heat conducting materials different from one another in terms of electrical resistivity, and a phase change layer disposed on the heater and having active regions respectively in contact with one of the heat conducting materials of the heater, and the programming method of the memory device comprises:
Dependencies are inferred from the claim text.