Method of producing heat dissipation substrate and method of producing composite substrate
AssigneeNichia Corporation
InventorsShoichi YAMADA, Takeshi KIHARA, Masatsugu ICHIKAWA
Life of this patent
Estimating the term…
Abstract
A method of producing a heat dissipation substrate, the method including: providing a composite material containing diamond and a metal; performing a treatment on a surface of the composite material to reduce a thickness of the composite material, the treatment forming a processed surface of the composite material; and subsequently, performing pulsed electric current sintering with a pressure of less than 50 MP applied to the composite material, to heat the composite material.
Claims13
A method of producing a heat dissipation substrate, the method comprising:
- providing a composite material containing diamond and a metal;
- performing a treatment on a surface of the composite material to reduce a thickness of the composite material, the treatment forming a processed surface of the composite material;
- and
- subsequently, performing pulsed electric current sintering with a pressure of less than 50 MP applied to the composite material, to heat the composite material.
A method of producing a composite substrate, comprising:
- providing a composite material comprising diamond and a metal, the composite material having been subjected to a treatment to reduce a thickness of the composite material;
- and
- subsequently, performing pulsed electric current sintering with a pressure of less than 50 MP applied to the composite material, to heat the composite material.
Dependencies are inferred from the claim text.