Display panel and manufacturing method thereof and display device

A display device, comprising a display panel,

• wherein the display panel comprises:
• a base substrate;
• wherein the base substrate is provided with a plurality of bonding electrodes;
• a plurality of micro light emitting displays (Micro-LEDs) are disposed on a side of the plurality of bonding electrodes facing away from the base substrate;
• and the plurality of Micro-LEDs are electrically connected to the plurality of bonding electrodes in one-to-one correspondence;
• and
• on a plane parallel to a plane where the base substrate is located, along a direction from a center of the base substrate to an edge of the base substrate, a size of each bonding electrode of the plurality of bonding electrodes gradually increases and/or a distance between centers of adjacent two of the plurality of bonding electrodes gradually increases to enable each Micro-LED of the plurality of Micro-LEDs to be bonded with a corresponding bonding electrode.

A manufacturing method of a display panel, comprising:

• obtaining a base substrate, wherein a plurality of bonding electrodes are disposed on the base substrate;
• and on a plane parallel to a plane where the base substrate is located and along a direction from a center of the base substrate to an edge of the base substrate, a size of each of the plurality of bonding electrodes gradually increases, or a distance between centers of adjacent two of the plurality of bonding electrodes gradually increases;
• obtaining a plurality of micro light emitting displays (Micro-LEDs) disposed in an array on a transfer substrate, wherein the plurality of Micro-LEDs and the transfer substrate are attached through a transfer material;
• the transfer material is a thermal expandable material;
• the plurality of Micro-LEDs form a chip array on the transfer substrate;
• each of the plurality of Micro-LED has a same size;
• and distances between adjacent Micro-LEDs are the same;
• and
• bonding each of the plurality of Micro-LEDs with a corresponding bonding electrode, so that after each of the plurality of Micro-LEDs is offset due to the transfer material, each of the plurality of Micro-LEDs are bonded with the corresponding bonding electrode.