US 2021/0242379 A1 · DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

Abstract

A display panel including an array substrate, a first sub-pixel, a second sub-pixel, and a first light-emitting diode is provided. The array substrate includes a first connection pad and a second connection pad. The first sub-pixel includes a first driving unit electrically connected to the first connection pad. The second sub-pixel includes a second driving unit electrically connected to the second connection pad. The first light-emitting diode completely overlaps and is physically isolated from the second connection pad. The first light-emitting diode is not completely overlapped and is electrically connected to the first connection pad. A manufacturing method of a display panel is also provided.

Claims14

Dependent claims

A display panel, comprising:

an array substrate comprising a first connection pad and a second connection pad;
a first sub-pixel comprising a first driving unit electrically connected to the first connection pad;
a second sub-pixel comprising a second driving unit electrically connected to the second connection pad;
and
a first light-emitting diode completely overlapping and physically isolated from the second connection pad, and not completely overlapping and electrically connected to the first connection pad.

2 more elements

A manufacturing method for a display panel, comprising:

providing an array substrate comprising a first connection pad and a second connection pad;
disposing a first light-emitting diode on the array substrate, and making the first light-emitting diode completely overlap the first connection pad and not completely overlap the second connection pad;
and
making the first light-emitting diode to be electrically connected to the second connection pad.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

16/987,374Filed 6 Aug 2020

Priority

TW 10910275430 Jan 2020

Published

5 Aug 2021

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

H10H 20/857
Packages: interconnections, e.g. lead-frames, bond wires or solder balls
H10W 90/00
Package configurations
G09G 3/32
Using electroluminescent panels: semiconductive, e.g. using light-emitting diodes [LED]
H10H 20/01
Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]: manufacture or treatment

Display panel and manufacturing method thereof

Life of this patent

Display panel and manufacturing method thereof

Life of this patent

Abstract

Claims14