Method of manufacturing light emitting device

A method of manufacturing a light emitting device, the method comprising:

• providing a light emitting element;
• providing a light transmissive member;
• and
• bonding the light emitting element and the light transmissive member by a surface activated bonding method, which comprises:
• activating a first bonding surface of the light emitting element to which the light transmissive member is to be bonded, by irradiating at least the first bonding surface with an ion beam of at least one rare gas element selected from the group consisting of He, Ne, Ar, and Kr,
• activating a second bonding surface of the light transmissive member to which the light emitting element is to be bonded, by irradiating at least the second bonding surface with an ion beam of at least one rare gas element selected from the group consisting of He, Ne, Ar, and Kr, and
• joining the light emitting element and the light transmissive member by bringing the activated first bonding surface and the activated second bonding surface into contact;
• wherein, in at least one of the step of activating the first bonding surface and the step of activating the second bonding surface, the rare gas element ion beam irradiates the first bonding surface or the second bonding surface at a predetermined angle such that the rare gas element is distributed with a higher density at a position deeper than a vicinity of the first bonding surface or the second bonding surface than at the vicinity of the first bonding surface or the second bonding surface.