Ic structure base and inner e/c material on raised insulator, and methods to form same
AssigneeGlobalFoundries U.S. Inc.
InventorsJagar Singh, Alexander L. Martin, Alexander M. Derrickson
Life of this patent
Estimating the term…
Loading patent…
AssigneeGlobalFoundries U.S. Inc.
InventorsJagar Singh, Alexander L. Martin, Alexander M. Derrickson
Estimating the term…
Embodiments of the disclosure provide an integrated circuit (IC) structure, including: a semiconductor base on a first portion of a raised region of an insulative layer; a first inner emitter/collector (E/C) material on a second portion of the raised region of the insulative layer, wherein the inner E/C material is directly horizontally between the semiconductor base and a sidewall of the raised region; and a first outer E/C material on a first non-raised region of the insulative layer, wherein an upper portion of the first outer E/C material is adjacent the first inner E/C material.
An integrated circuit (IC) structure, comprising:
An integrated circuit (IC) structure, comprising:
A method of forming an integrated circuit (IC) structure, the method comprising:
Dependencies are inferred from the claim text.