Silicon carbide trench semiconductor device
AssigneeAlpha and Omega Semiconductor (Cayman) Ltd.
InventorsDavid Sheridan, Vipindas Pala, Madhur Bobde
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AssigneeAlpha and Omega Semiconductor (Cayman) Ltd.
InventorsDavid Sheridan, Vipindas Pala, Madhur Bobde
Estimating the term…
A semiconductor apparatus has a silicon carbide substrate heavily doped with the first conductivity type and a lightly doped silicon carbide drift region of the first conductivity type over the silicon carbide substrate. A first body region in the drift region is doped with second conductivity type opposite the first. A first source region in the first body region is heavily doped with the first conductivity type. A gate trench is formed in the first source region and first body region. At least one sidewall of the gate trench is parallel to a crystal plane of the silicon carbide structure having greater carrier mobility than a C-face thereof. The gate trench extends a length of the first body region and the source region to a separation region laterally adjacent to the first region wherein the separation region is in the drift region.
An apparatus, comprising:
The apparatus of claim 2, wherein a doping concentration of the first body region increases with depth so that a maximum dopant concentration occurs at a maximum depth of the body region
A method for making a silicon carbide trench semiconductor device, comprising:
Dependencies are inferred from the claim text.