Back to results
US 2021/0242287 A1Published application
Integration of microdevices into system substrate
AssigneeVueReal Inc.
InventorsGholamreza Chaji, Ehsanollah Fathi
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a pixelated structure may be provided. The method may comprise providing a donor substrate comprising the plurality of pixelated microdevices, bonding a selective set of the pixelated microdevices from the donor substrate to a system substrate; and patterning a bottom conductive layer of the pixelated microdevices after separating the donor substrate from the system substrate. The patterning may be done by fully isolating the layers or leaving some thin layers between the patterns.
Claims11
A method of manufacturing a pixelated structure comprising:
- providing a donor substrate comprising a plurality of pixelated microdevices;
- bonding a selective set of the plurality of pixelated microdevices from the donor substrate to a system substrate;
- and
- patterning at least one bottom planar layer of the plurality of pixelated microdevices after separating the donor substrate from the system substrate,
- wherein the at least one bottom planar layer comprises one of:
- a bottom conductive layer or a bottom doped layer.
3 more elements
Dependencies are inferred from the claim text.