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US 2021/0242269 A1Published application
Image sensor package
AssigneeCanon Kabushiki Kaisha
InventorDaisuke Toda
Life of this patent
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Abstract
An image sensor package includes an image sensor, a printed circuit board having a plurality of conductor layers, and a resin molded portion provided so as to surround an outer circumference of the printed circuit board. A first conductor layer among the plurality of conductor layers, which is closest to the resin molded portion has a dummy pattern formed along a circumference inside the resin molded portion.
Claims8
An image sensor package comprising:
- an image sensor;
- a printed circuit board having a plurality of conductor layers;
- and
- a resin molded portion provided so as to surround an outer circumference of the printed circuit board,
- wherein a first conductor layer among the plurality of conductor layers, which is closest to the resin molded portion has a dummy pattern formed along a circumference inside the resin molded portion.
2 more elements
Dependencies are inferred from the claim text.