Encapsulated fan-in semiconductor package with heat spreader and method of manufacturing the same
AssigneeChengdu Eswin Sip Technology Co., Ltd.
InventorsMinghao SHEN, Xiaotian ZHOU
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Abstract
Disclosed is a method of manufacturing a semiconductor device that includes securing a lower surface of a wafer to a supporting surface of a carrier substrate formed of copper or other metal having good thermal conductance. Further semiconductor processing for packaging can include forming an RDL on the wafer, etching scribe channels through the wafer, and coating the wafer with encapsulant. After dicing, the metal carrier remains in contact with and supporting the lower surface of the wafer, and the remainder of the wafer remains coated by the encapsulant.
Claims20
A method of manufacturing a semiconductor device, comprising:
- providing a wafer having a plurality of integrated circuits;
- securing a lower surface of the wafer to a supporting surface of a carrier substrate;
- forming a redistribution layer (RDL) on an upper surface of the wafer, the upper surface of the wafer being opposite the lower surface of the wafer;
- etching scribe channels through the RDL and at least a portion of the wafer towards the carrier substrate in the wafer from the RDL, to the carrier substrate;
- encapsulating the wafer and RDL, within an encapsulant, including providing a portion of the encapsulant in the scribe channels;
- and
- dicing the wafer and carrier substrate along the scribe channels without exposing the wafer such that the wafer remains covered on a first portion thereof by the carrier substrate and a remaining portion thereof by the encapsulant.
An integrated circuit package, comprising:
- a semiconductor wafer having an integrated circuit formed therein;
- an RUL formed on an upper surface of the wafer;
- a carrier substrate having a metal upper surface bonded to a lower surface of the semiconductor wafer by ionic bonding;
- and
- an encapsulant coating at least a portion of the sides and upper surface of the wafer.
Dependencies are inferred from the claim text.