US 2021/0242165 A1Published application

Manufacturing method for semiconductor device

AssigneeNitto Denko Corporation

InventorsRyota MITA, Tomoaki ICHIKAWA

Life of this patent

Estimating the term…

Loading patent…

Abstract

A semiconductor device manufacturing method includes a preparation step and a sinter bonding step. In the preparation step, a sinter-bonding work having a multilayer structure including a substrate, semiconductor chips, and sinter-bonding material layers is prepared. The semiconductor chips are disposed on, and will bond to, one side of the substrate. Each sinter-bonding material layer contains sinterable particles and is disposed between each semiconductor chip and the substrate. In the sinter bonding step, a cushioning sheet having a thickness of 5 to 5000 μm and a tensile elastic modulus of 2 to 150 MPa is placed on the sinter-bonding work, the resulting stack is held between a pair of pressing faces, and, in this state, the sinter-bonding work between the pressing faces undergoes a heating process while being pressurized in its lamination direction, to form a sintered layer from each sinter-bonding material layer.

Claims6

Dependent claims

A method for manufacturing a semiconductor device, the method comprising the steps of

preparing a sinter-bonding work having a multilayer structure including
a substrate having a first surface, and a second surface opposite to the first surface;
a plurality of semiconductor chips facing, and to bond to, the first surface of the substrate;
and
a plurality of sinter-bonding material layers each being disposed between the substrate and each semiconductor chip and containing sinterable particles;
and
sinter-bonding the sinter-bonding work, the step of sinter bonding comprising:
overlaying the sinter-bonding work and a cushioning sheet having a thickness of 5 to 5000 μm and a tensile elastic modulus of 2 to 150 MPa on each other to give a stack;
holding the stack between a pair of pressing faces;
and
subjecting the sinter-bonding work in the stack held between the pair of pressing faces to a heating process while pressurizing the work in a lamination direction of the work, to form sintered layers from the sinter-bonding material layers.

8 more elements

Dependencies are inferred from the claim text.