Semiconductor arrangement and method for producing the same

A method for producing a semiconductor arrangement, the method comprising:

• mounting a plurality of bonding wires on a controllable semiconductor element, the controllable semiconductor element comprising an active region,
• wherein mounting the plurality of bonding wires on the controllable semiconductor element comprises:
• for each of the plurality of bonding wires, forming a first number of bond connections between the bonding wire and the controllable semiconductor element, thereby electrically and mechanically coupling the bonding wire to the controllable semiconductor element,
• wherein:
• the plurality of bonding wires is arranged in parallel to each other in a first horizontal direction;
• the active region has a first length in the first horizontal direction and a first width in a second horizontal direction perpendicular to the first horizontal direction;
• each of the bond connections is arranged above the active region in a vertical direction that is perpendicular to the first horizontal direction and the second horizontal direction;
• a first bond connection of each of the plurality of bonding wires is arranged at a first distance from a first edge of the active region in the first horizontal direction,
• the first distance is less than the first length divided by twice the first number of bond connections,
• the first bond connection of each of the plurality of bonding wires is the bond connection arranged closest to the first edge,
• a second bond connection of each of the plurality of bonding wires is arranged at a second distance from a second edge of the active region in the first horizontal direction,
• the second edge is arranged opposite the first edge,
• the second distance is less than the first length divided by twice the first number of bond connections,
• the second bond connection of each of the plurality of bonding wires is the bond connection arranged closest to the second edge.