Semiconductor assembly and method of manufacturing the same

A method of manufacturing a semiconductor assembly, comprising:

• providing a first device and forming a first bonding layer on the first device;
• providing a second device and forming a second bonding layer on the second device;
• stacking the second device on the first device and bringing the first bonding layer into contact with the second bonding layer;
• fusing the first bonding layer and the second bonding layer;
• depositing a cap dielectric layer on the second device;
• forming an interconnect structure to electrically connect the second device to the first device, wherein forming of the interconnect structure comprises:
• forming a first trench through the cap dielectric layer, the second device, the second bonding layer and the first bonding layer to expose a first conductive feature of the first device;
• forming a second trench in the second device to expose a second conductive feature of the second device simultaneously with the forming of the first device;
• and
• depositing a conductive material in the first trench and the second trench.