Semiconductor device with frame having arms and related methods

A semiconductor device comprising a substrate an opening extending through a thickness of the substrate, the substrate having a first major surface and a second major surface;

• a frame comprising a rectangle-shaped integrated circuit (IC) die pad in the opening, and a plurality of arms free from an overlying contact pad, the rectangle-shaped IC die pad having first and second opposing surfaces, the second opposing surface being exposed through the opening of the substrate;
• wherein each arm comprises
• a distal end coupled to the first major surface of the substrate, and
• a proximal end disposed over the first major surface of the substrate;
• an IC mounted on the rectangle-shaped IC die pad, the IC being adjacent to the first opposing surface of the rectangle-shaped IC die pad;
• a plurality of bonding elements electrically coupling the substrate with the IC without the frame being an intermediary coupling element;
• and
• an encapsulant surrounding the IC, the plurality of bonding elements, and the plurality of arms.

A semiconductor device comprising:

• a substrate comprising an opening extending through a thickness of the substrate, the substrate having a first major surface and a second major surface;
• a frame devoid of an electrical connection to an element external to the frame and comprising an integrated circuit (IC) die pad in the opening, and a plurality of arms extending outwardly from said IC die pad;
• wherein each arm comprises a distal end coupled to the first major surface of the substrate and being aligned with an outer lateral edge of the substrate, and
• a proximal end disposed over the first major surface of the substrate;
• an IC mounted on the IC die pad;
• a plurality of bonding elements electrically coupling the substrate with the IC;
• an encapsulant surrounding the IC, the plurality of bonding elements, and the plurality of arms;
• and
• an adhesive layer between respective distal ends of the plurality of arms and the substrate.