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US 2021/0242099 A1Published application
Electronic device mounting board, electronic package, and electronic module
AssigneeKYOCERA Corporation
InventorsFumiaki TAKESHITA, Teruaki NONOYAMA
Life of this patent
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Abstract
A substrate has a first surface and a second surface opposite to the first surface. The substrate has at least one first recess on the first surface and a second recess on the second surface. The substrate includes electrode pads. The electrode pads are in the at least one first recess. The substrate has the at least one first recess located separate from the second recess in a plan view.
Claims13
An electronic device mounting board, comprising:
- a substrate having a first surface and a second surface opposite to the first surface;
- at least one first recess located on the first surface and comprising a side wall;
- a second recess located on the second surface;
- and
- electrode pads located in the at least one first recess and comprising a side surface, at least a portion of the side surface being apart from the side wall of the at least one first recess,
- wherein the electrode pads are located separate from the second recess in a plan view.
3 more elements
Dependencies are inferred from the claim text.