Variable thickness lid adhesive

A module of containing a plurality of components, comprising:

• one or more chip pairs each having a first semiconductor chip and a second semiconductor chip, each chip pair having a spacing forming a spacing region between the first and second semiconductor chips, the first and second semiconductor chips each having a chip back side;
• a substrate on which the chip pairs are disposed;
• a lid having a lid bottom side and one or more feet, the feet protruding from a periphery of the lid bottom side, the lid further having a shortened central lid rib with a bottom, the shorten central lid rib protruding an extension distance from the lid bottom side into the spacing region;
• a sealband adhesive with a sealband adhesive thickness, the sealband adhesive adhering the feet to the substrate, so the chip pairs are under the lid bottom side and the chip back sides are in thermal contact with the lid bottom side;
• and
• a variable thickness lid adhesive that connects the bottom to the substrate in the spacing region, the variable thickness lid adhesive having a lid adhesive thickness,
• wherein the lid adhesive thickness is greater than the sealband adhesive thickness by a delta thickness amount.

A method of making a semiconductor module comprising the steps of:

• laying a sealband adhesive around a perimeter of the module, the sealband adhesive having a sealband adhesive thickness;
• laying a lid adhesive with a lid adhesive thickness between two semiconductor chips disposed on a substrate in the module, the lid adhesive thickness being thicker than the sealband adhesive thickness by a delta thickness amount;
• placing a lid on the substrate, the lid having a lid bottom side and one or more feet, the feet protruding from a periphery of the lid bottom side, the lid further having a shortened central lid rib with a bottom, the shorten central lid rib protruding an extension distance from the lid bottom side,
• wherein the bottom is in contact with the lid adhesive and the feet are in contact with the sealband adhesive.