Method of Packaging an Integrated Circuit

A product produced by a process comprising:

• (a) providing:
• (i) an integrated circuit having a two-dimensional contact array on a top surface thereof, (ii) a polymer shell lower portion, and (iii) a polymer shell upper portion, said upper portion having a two-dimensional array of openings formed therein, which array of openings corresponds to said two dimensional contact array,
• wherein one or both of said polymer shell upper and lower portions are produced by the process of additive manufacturing, and
• (b) enclosing said integrated circuit between said polymer shell lower portion and said polymer shell upper portion with said contact array aligned with array of openings to produce a integrated circuit packaged within a polymer shell.

A packaged integrated circuit product, comprising:

• (a) an integrated circuit having a two-dimensional contact array on a top surface thereof,
• (b) a polymer shell lower portion, and
• (c) a polymer shell upper portion connected to said polymer shell lower portion with said integrated circuit enclosed therein, said upper portion having a two-dimensional array of openings formed therein, which array of openings corresponds to said two-dimensional contact array;
• wherein one or both of said polymer shell upper and lower portions are produced by the process of additive manufacturing;
• and
• (d) optionally but preferably a conductor filing said openings and providing an external contact array on the surface of said polymer shell corresponding to and electrically connected to said two-dimensional contact array.