Mounting substrate and electronic apparatus
AssigneeSony Semiconductor Solutions Corporation
InventorsAkiyoshi Aoyagi, Ken Kikuchi, Katsuhiro Tomoda
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AssigneeSony Semiconductor Solutions Corporation
InventorsAkiyoshi Aoyagi, Ken Kikuchi, Katsuhiro Tomoda
Estimating the term…
A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (30); a plurality of light-emitting elements (12) arranged in a matrix on the wiring substrate; and a plurality of drive ICs (13) that are arranged in a matrix on the wiring substrate, and control light emission of the light-emitting elements. The light-emitting elements and the drive ICs are mounted on a same surface. The wiring substrate includes a plurality of first wiring lines (16) on a mounting surface whre the light-emitting elements and the dive ICs are mounted. The first wiring lines electrically couple the light-emitting elements to the drive ICs.
A mounting substrate, comprising:
An electronic apparatus provided with one or a plurality of mounting substrates and a control circuit that controls the one or plurality of mounting substrates, each of the mounting substrates comprising:
Dependencies are inferred from the claim text.