Semiconductor structure and method for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHwei-Jay CHU, Chieh-Han WU, Cheng-Hsiung TSAI, Chih-Wei LU, Chung-Ju LEE
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHwei-Jay CHU, Chieh-Han WU, Cheng-Hsiung TSAI, Chih-Wei LU, Chung-Ju LEE
Estimating the term…
A method for forming a semiconductor structure includes forming a first cap layer over a metal layer. The method also includes patterning the metal layer and the first cap layer to form openings exposing the gate structure, and forming a first dielectric layer in the openings, and patterning the first cap layer to form a via cap plug over the metal layer. The method also includes forming a second dielectric layer over the via cap plug and the metal layer, and forming a trench in the second dielectric material to expose the via cap plug. The method also includes removing the via cap plug to enlarge the trench and filling the trench with a conductive material.
A method for forming a semiconductor structure, comprising:
A method for forming a semiconductor structure, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.