System and Method for Semiconductor Device Print Check Alignment

A system, comprising:

• an optical inspection sub-system configured to acquire images of a sample;
• a controller communicatively coupled to the optical inspection sub-system, the controller including one or more processors configured to execute a set of program instructions stored in memory, the set of program instructions configured to cause the one or more processors to:
• receive one or more training images of a first sample from the optical inspection sub-system, the first sample including a master die;
• identify one or more alignment targets in the master die and store the one or more alignment targets in memory;
• receive a first set of one or more reference images of a first die row of a second sample from the optical inspection sub-system, the first die row including a master die and a first set of one or more reference die;
• align the first set of one or more reference die to the master die via one or more fine alignment processes to generate a first set of one or more aligned reference images of the first row;
• receive a second set of one or more reference images of a second die row of the second sample from the optical inspection sub-system, the second die row including a second set of one or more reference die;
• align the second set of one or more reference die to the master die based on the alignment targets and the one or more training images using a course alignment offset value;
• and
• align the second set of one or more reference die to the master die via a fine alignment process to generate a second set of one or more aligned reference images of the second die row.

A method, comprising:

• acquiring one or more training images of a sample, the sample including a master die;
• identifying one or more alignment targets in the master die and storing the one or more alignment targets in memory;
• acquiring a first set of one or more reference images of a first die row of a sample, the first die row including a master die and a first set of one or more reference die;
• aligning the first set of one or more reference die to the master die via one or more fine alignment processes to generate a first set of one or more aligned reference images of the first row;
• acquiring a second set of one or more reference images of a second die row of the sample, the second die row including a second set of one or more reference die;
• aligning the second set of one or more reference die to the master die based on the alignment targets and the one or more training images using a course alignment offset value;
• and
• aligning the second set of one or more reference die to the master die via a fine alignment process to generate a second set of one or more aligned reference images of the second die row.