Mass transfer method and mass transfer device thereof for micro led device

Mass transfer equipment of micro-LED devices, comprising:

• coating equipment, configured to coat a surface, provided with micro-LED devices, of an epitaxial substrate with a flexible covering solution;
• curing equipment, configured to cure the flexible covering solution to form a flexible covering layer wrapping the micro-LED devices;
• turning equipment, configured to:
• turn over the epitaxial substrate with the flexible covering layer wrapping the micro-LED devices, for locating the epitaxial substrate on an upper side of the flexible covering layer;
• separate the epitaxial substrate from the micro-LED devices, for enabling the flexible covering layer to serve as a carrier of the micro-LED devices;
• butt a surface, provided with the micro-LED devices, of the flexible covering layer against a receiving substrate;
• and
• turn over the receiving substrate in butt joint with the micro-LED devices, for locating the flexible covering layer on an upper side of the receiving substrate;
• and
• separating equipment, configured to separate the flexible covering layer from the micro-LED devices, for enabling the receiving substrate to serve as the carrier of the micro-LED devices.