Mounting apparatus and film supply apparatus
AssigneeKabushiki Kaisha Shinkawa
InventorsYuichiro NOGUCHI, Katsutoshi NOMURA
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AssigneeKabushiki Kaisha Shinkawa
InventorsYuichiro NOGUCHI, Katsutoshi NOMURA
Estimating the term…
A mounting apparatus (10) serves to place a film between an electronic component and a bottom surface of a mounting head and mount the electronic component. The mounting apparatus includes: a film winding mechanism (18) that rotates a winding reel (26) to wind in a film spanning from a dispensing reel to the winding reel (26), the film winding mechanism (18) executing the winding so that a new film is disposed on the bottom surface of the mounting head each time when an electronic component is mounted; a tension detecting part (38) that detects the tension of the film after the same is wound by the film winding mechanism (18); and a control part (20) that rotates the winding reel (26) by a winding motor (30) to adjust the tension on the basis of the tension detected by the tension detecting part (38). A film supply apparatus is also provided.
A mounting apparatus, configured to place a film between an electronic component and a bottom surface of a mounting head and mount the electronic component, the mounting apparatus comprising:
A film supply apparatus, comprising:
Dependencies are inferred from the claim text.