Substrate bonding device, calculation device, substrate bonding method, and calculation method

A substrate bonding apparatus comprising:

• a first holding unit for holding a first substrate;
• and
• a second holding unit for holding a second substrate,
• wherein the substrate bonding apparatus is configured to bond the first substrate and the second substrate by, after forming a contact region between a part of the first substrate and a part of the second substrate, expanding the contact region while at least an outer circumferential portion of the second substrate is held by the second holding unit and then releasing the outer circumferential portion of the second substrate from the second holding unit, and
• wherein the second holding unit is configured to hold the outer circumferential portion of the second substrate so that restoring of a curve in the outer circumferential portion of the second substrate is suppressed when the second substrate is released.

A substrate bonding apparatus comprising:

• a first holding unit for holding a first substrate;
• and
• a second holding unit for holding a second substrate,
• wherein the substrate bonding apparatus is configured to bond the first substrate and the second substrate by releasing the second substrate from the second holding unit while a contact region formed between a part of the first substrate and a part of the second substrate is expanding, and
• wherein a timing of releasing the second substrate from the second holding unit is different from a timing of releasing a substrate, other than the second substrate, from the second holding unit.

A substrate bonding method comprising:

• holding a first substrate on a first holding unit;
• holding a second substrate on a second holding unit,
• after forming a contact region between a part of the first substrate and a part of the second substrate, expanding the contact region to form an initially bonded region;
• and
• by releasing the second substrate having the initially bonded region formed thereon from the second holding unit, bonding the first substrate and the second substrate.