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US 2021/0242042 A1Published application
Processing apparatus
AssigneeToshiba Memory Corporation
InventorsKosuke TAKAI, Mana TANABE, Hideaki SAKURAI
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AssigneeToshiba Memory Corporation
InventorsKosuke TAKAI, Mana TANABE, Hideaki SAKURAI
Estimating the term…
According to one embodiment, a processing apparatus for processing substrates having different base shapes includes a stage comprising a first portion having a substrate facing surface and an opening extending therethough connected to a source of a cooling fluid, and a second portion located outwardly of the first portion, a substrate support, having a substrate support surface thereon, extending over the second portion, a process fluid outlet overlying the first portion, and a driving unit coupled to one of the stage and the first portion, wherein the driving unit is configured to move at least one of the substrate support surface and the substrate facing surface such that the relative locations of the substrate support surface and the substrate facing surface of the stage are changeable based on the shape of a substrate to be processed in the apparatus.
A processing apparatus for processing substrates of a first type having a recess including a recess formed of a peripheral surface extending inwardly of the rear surface side thereof and ending in an inner generally flat wall, and substrates wherein the rear surface side is flat, comprising:
The processing apparatus according to 1, wherein the substrate holder further comprises a substrate contact portion on the base portion and configured to support a first substrate and a through hole extending through the projection portion.
The processing apparatus according to 2, wherein the projection portion is sized such that a distance between a peripheral surface of the recess and an outer peripheral surface of the projection portion is a predetermined distance when the first substrate is held by the substrate holder.
A processing apparatus for processing substrates, comprising:
The processing apparatus according to 8, wherein
The processing apparatus according to 10, wherein the diameter of the projection portion is set to be less than the diameter of the recess of the substrate.
Dependencies are inferred from the claim text.