Universal semiconductor package molds
AssigneeTexas Instruments Incorporated
InventorsAnis Fauzi BIN ABDUL AZIZ, Chong Han LIM, Lee Han Meng@Eugene LEE, Wei Fen Sueann LIM
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Abstract
In accordance with at least one example of the disclosure, a system comprises a semiconductor package, comprising a first side surface having a first set of metal contacts extending therefrom; a second side surface having a second set of metal contacts extending therefrom; a top surface; a bottom surface; and an end surface meeting at least one of the first side surface, the second side surface, the top surface, and the bottom surface at a non-rounded edge.
Claims17
A method of forming a semiconductor package, comprising:
- providing a first lead frame having a first plurality of semiconductor dies arranged along a first longitudinal axis, each of the first plurality of semiconductor dies having a first number of metal contacts;
- providing a second lead frame having a second plurality of semiconductor dies arranged along a second longitudinal axis, each of the second plurality of semiconductor dies having a second number of metal contacts;
- and
- encapsulating the first plurality of semiconductor dies in a first mold using a common semiconductor die cavity;
- encapsulating the second plurality of semiconductor dies in a second mold using the common semiconductor die cavity.
A semiconductor packaging system, comprising:
- a semiconductor packaging mold, comprising:
- a mold compound storage cavity;
- a plurality of semiconductor die cavities, each semiconductor die cavity configured to accommodate multiple semiconductor dies along a longitudinal axis of the semiconductor die cavity and further configured to accommodate a mold compound such that the mold compound abuts the multiple semiconductor dies;
- and
- a plurality of runner cavities extending from the mold compound storage cavity to the plurality of semiconductor die cavities.
Dependencies are inferred from the claim text.