Method of manufacturing semiconductor device, recording medium, and substrate processing apparatus
AssigneeKokusai Electric Corporation
InventorsKoei KURIBAYASHI, Arito OGAWA, Atsuro SEINO
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AssigneeKokusai Electric Corporation
InventorsKoei KURIBAYASHI, Arito OGAWA, Atsuro SEINO
Estimating the term…
There is provided a technique that includes: (a) supplying a molybdenum-containing gas containing molybdenum and oxygen to a substrate in a process chamber; (b) supplying an additive gas containing hydrogen to the substrate; and (c) supplying a reducing gas containing hydrogen and having a chemical composition different from that of the additive gas to the substrate, wherein at least two of (a), (b), and (c) are performed simultaneously or to partially overlap with each other in time one or more times or (a), (b), and (c) are performed sequentially one or more times to form a molybdenum film on the substrate.
A method of manufacturing a semiconductor device, comprising:
A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform a process comprising:
A substrate processing apparatus comprising:
Dependencies are inferred from the claim text.