Method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus
AssigneeKokusai Electric Corporation
InventorArito OGAWA
Life of this patent
Estimating the term…
Loading patent…
AssigneeKokusai Electric Corporation
InventorArito OGAWA
Estimating the term…
Described herein is a technique capable of suppressing the generation of particles due to a film peeling in a process chamber. According to one aspect of the technique, there is provided a method of manufacturing a semiconductor device, including: (a) loading a substrate with an oxide film formed thereon into a process chamber wherein a metal-containing film is formed on a wall or other location in the process chamber; (b) supplying into the process chamber with at least one among: a gas containing a group 14 element and hydrogen; and a gas containing oxygen; and (c) forming the metal-containing film on the substrate after (b).
A method of manufacturing a semiconductor device, comprising:
A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform:
A substrate processing apparatus comprising:
Dependencies are inferred from the claim text.