Semiconductor structure with an epitaxial layer
AssigneeUnited Microelectronics Corp.
InventorsHsiao-Pang Chou, Hon-Huei Liu, Ming-Chang Lu, Chin-Fu Lin, Yu-Cheng Tung
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AssigneeUnited Microelectronics Corp.
InventorsHsiao-Pang Chou, Hon-Huei Liu, Ming-Chang Lu, Chin-Fu Lin, Yu-Cheng Tung
Estimating the term…
The present invention discloses a semiconductor structure with an epitaxial layer, including a substrate, a blocking layer on said substrate, wherein said blocking layer is provided with predetermined recess patterns, multiple recesses formed in said substrate, wherein each of said multiple recesses is in 3D diamond shape with a centerline perpendicular to a surface of said substrate, a buffer layer on a surface of each of said multiple recesses, and an epitaxial layer comprising a buried portion formed on said buffer layer in each of said multiple recesses and only one above-surface portion formed directly above said blocking layer and directly above said recess patterns of said blocking layer, and said above-surface portion directly connects said buried portion in each of said multiple recesses, and a first void is formed inside each of said buried portions of said epitaxial layer in said recess.
A semiconductor structure with an epitaxial layer, comprising:
Dependencies are inferred from the claim text.