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US 2021/0242015 A1Published application
Substrate processing apparatus and substrate cleaning method
AssigneeEbara Corporation
InventorTomoatsu Ishibashi
Life of this patent
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Abstract
Provided is a substrate processing apparatus including: a first cleaning member configured to clean a substrate by a contact face on which a skin layer is provided; and a second cleaning member configured to clean the substrate after cleaned by the first cleaning member, by a contact face on which a skin layer is not provided.
Claims11
A substrate processing apparatus comprising:
- a first cleaning member configured to clean a substrate by a contact face on which a skin layer is provided;
- and
- a second cleaning member configured to clean the substrate after cleaned by the first cleaning member, by a contact face on which a skin layer is not provided.
A substrate cleaning method comprising:
- a first cleaning step configured to clean a substrate by a contact face of a first cleaning member, a skin layer being provided on the contact face;
- and
- a second cleaning step after the first cleaning step configured to clean the substrate by a contact face of a second cleaning member, a skin layer not being provided on the contact face.
Dependencies are inferred from the claim text.