Water soluble organic-inorganic hybrid mask formulations and their applications
AssigneeApplied Materials, Inc.
InventorsWenguang Li, James S. Papanu
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Abstract
Water soluble organic-inorganic hybrid masks and mask formulations, and methods of dicing semiconductor wafers are described. In an example, a mask for a wafer singulation process includes a water-soluble matrix based on a solid component and water. A p-block metal compound, an s-block metal compound, or a transition metal compound is dissolved throughout the water-soluble matrix.
Claims20
A mask for a wafer singulation process, the mask comprising:
- a water-soluble matrix based on a solid component and water;
- and
- a p-block metal compound, an s-block metal compound, or a transition metal compound dissolved throughout the water-soluble matrix.
A method of dicing a semiconductor wafer comprising a plurality of integrated circuits, the method comprising:
- forming a mask above the semiconductor wafer, the mask comprising a water-soluble matrix based on a solid component and water, and the mask comprising a p-block metal compound, an s-block metal compound, or a transition metal compound dissolved throughout the water-soluble matrix;
- patterning the mask and a portion of the semiconductor wafer with a laser scribing process to provide a patterned mask with gaps and corresponding trenches in the semiconductor wafer in regions between the integrated circuits;
- and
- plasma etching the semiconductor wafer through the gaps in the patterned mask to extend the trenches and to singulate the integrated circuits, wherein the patterned mask protects the integrated circuits during the plasma etching.
A method of dicing a semiconductor wafer comprising a plurality of integrated circuits, the method comprising:
- forming a mask above the semiconductor wafer, the mask comprising a water-soluble matrix based on a solid component and water, and the mask comprising a p-block metal compound, an s-block metal compound, or a transition metal compound dissolved throughout the water-soluble matrix;
- and
- patterning the mask and singulating the integrated circuits of the semiconductor wafer with a plasma etching process, wherein the patterned mask protects the integrated circuits during the plasma etching.
Dependencies are inferred from the claim text.