Substrate processing system and substrate processing method
AssigneeTokyo Electron Limited
InventorHayato TANOUE
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Abstract
A substrate processing system configured to process a substrate includes an eccentricity detection device configured to detect, in a combined substrate in which a first substrate and a second substrate are bonded to each other, an eccentricity of the first substrate; a modification layer forming device configured to form a modification layer within the first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate; and a periphery removing device configured to remove the peripheral portion starting from the modification layer.
Claims21
A substrate processing system configured to process a substrate, comprising:
- an eccentricity detection device configured to detect, in a combined substrate in which a first substrate and a second substrate are bonded to each other, an eccentricity of the first substrate;
- a modification layer forming device configured to form a modification layer within the first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate;
- and
- a periphery removing device configured to remove the peripheral portion starting from the modification layer.
A substrate processing method of processing a substrate, comprising:
- detecting, in a combined substrate in which a first substrate and a second substrate are bonded to each other, an eccentricity of the first substrate;
- forming a modification layer within the first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate;
- and
- removing the peripheral portion starting from the modification layer.
Dependencies are inferred from the claim text.