Structural Lead Frame
AssigneeKemet Electronics Corporation
InventorsGalen W. Miller, John Bultitude, Lonnie G. Jones
Life of this patent
Estimating the term…
Abstract
Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.
Claims71
An electronic component package comprising:
- a multiplicity of electronic components wherein each electronic component of said electronic components comprises a first external termination and a second external termination;
- a structural lead frame comprising multiple leads wherein each lead of said multiple leads is mounted to at least one said first external termination;
- and
- wherein said structural lead frame comprises at least one break away feature between adjacent said leads.
An electrical circuit assembly comprising:
- an electronic component package comprising:
- a multiplicity of electronic components wherein each electronic component of said electronic components comprises a first external termination and a second external termination;
- a structural lead frame comprising multiple leads wherein each lead of said multiple leads is mounted to at least one said first external termination;
- and
- wherein said structural lead frame comprises at least one break away feature between adjacent said leads;
- and
- a circuit board wherein said circuit board comprises a first trace and a second trace and at least one said lead is in electrical contact with said first trace.
A method of forming an electrical circuit assembly comprising:
- forming an electronic component package comprising:
- arranging a multiplicity of electronic components into an array wherein each electronic component of said electronic components comprises a first external termination and a second external termination;
- attaching a structural lead frame to said array of electronic components to form an electrical component package wherein said structural lead frame comprises multiple leads wherein each lead of said multiple leads is mounted to at least one said first external termination and wherein said structural lead frame comprises at least one break away feature between adjacent said leads;
- and
- attaching said electrical component package to a circuit board wherein said circuit board comprises a first trace and a second trace and at least one said lead is in electrical contact with said first trace.
Dependencies are inferred from the claim text.