Metrology data correction using image quality metric
AssigneeASML Netherlands B.V.
InventorsFuming WANG, Stefan HUNSCHE, Wei FANG
Life of this patent
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Abstract
A method for correcting metrology data of a patterning process. The method includes obtaining (i) metrology data of a substrate subjected to the patterning process and (ii) a quality metric (e.g., a focus index) that quantifies a quality of the metrology data of the substrate; establishing a correlation between the quality metric and the metrology data; and determining a correction to the metrology data based on the correlation between the quality metric and the metrology data.
Claims20
A method for correcting metrology data of a patterning process, the method comprising:
- obtaining (i) metrology data of a substrate subjected to the patterning process and (ii) an image quality metric that quantifies a quality of the metrology data of the substrate;
- establishing, via a hardware computing system, a correlation between the image quality metric and the metrology data;
- and
- determining, via the computing system, a correction to the metrology data based on the correlation between the image quality metric and the metrology data.
A computer program product comprising a non-transitory computer readable medium having instructions therein, the instructions, when executed by a computer system, configured to cause the computer system to at least:
- obtain (i) metrology data of a substrate subjected to a patterning process and (ii) an image quality metric that quantifies a quality of the metrology data of the substrate;
- establish a correlation between the image quality metric and the metrology data;
- and
- determine a correction to the metrology data based on the correlation between the image quality metric and the metrology data.
Dependencies are inferred from the claim text.