Stacked memory device and operating method thereof

A method of operating a stacked memory device including a plurality of memory chips stacked in a vertical direction, the method comprising:

• receiving a command and an address from a memory controller;
• determining chip IDs each indicating one memory chip among the plurality of memory chips by decoding the address;
• and
• sequentially accessing at least two memory chips among the plurality of memory chips based on the chip IDs such that the at least two memory chips are non-adjacent.

A stacked memory device comprising a plurality of memory dies stacked in a vertical direction,

• wherein the plurality of memory dies comprise:
• a first memory die;
• a third memory die electrically connected to the first memory die through first TSVs;
• and
• a second memory die between the first memory die and the third memory die,
• wherein the second memory die is not connected to the first TSVs.