Wiring structure manufacturing method and wiring structure
AssigneeJapan Aviation Electronics Industry, Limited
InventorsAkitoshi SAKAUE, Yutaka TAKEZAWA
Life of this patent
Estimating the term…
Loading patent…
AssigneeJapan Aviation Electronics Industry, Limited
InventorsAkitoshi SAKAUE, Yutaka TAKEZAWA
Estimating the term…
A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base.
A method for producing a wiring structure of a touch panel having defined a sensor region therein, the method comprising:
A method for mass-producing a wiring structure of a touch panel having defined a sensor region therein by offset-printing conductive ink on a base, the method comprising repetition of a combination of:
Dependencies are inferred from the claim text.