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US 2021/0240075 A1Published application
Stamp and method for embossing
AssigneeEV Group E. Thallner GmbH
InventorsMarkus WIMPLINGER, Gerald MITTENDORFER
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Abstract
A stamp comprised of a soft stamp and a carrier fixed to the soft stamp.
Claims20
A stamp comprising:
- a soft stamp;
- and
- a bendable carrier fixed on the soft stamp, wherein the carrier comprises at least one heating element and the soft stamp is fixed detachably to the carrier.
(canceled)
A device comprising:
- a stamp comprising:
- a soft stamp, and
- a bendable carrier fixed on the soft stamp, wherein the carrier comprises at least one heating element and the soft stamp is fixed detachably to the carrier;
- and
- a control unit for controlling the at least one heating element.
2 more elements
A method for embossing an embossing compound with a stamp comprising a soft stamp and a bendable carrier fixed on the soft stamp, wherein the carrier comprises at least one heating element and the soft stamp is fixed detachably to the carrier, said method comprising:
- coating a substrate with the embossing compound, aligning the stamp relative to the substrate, embossing the embossing compound by use of the stamp,
- heating the embossing compound by use of the at least one heating element of the carrier,
- removing the stamp from the embossing compound.
Dependencies are inferred from the claim text.