Metalens unit, semiconductor fault analysis device, and semiconductor fault analysis method

A semiconductor fault analysis method comprising:

• an installation step of installing a semiconductor device as an observation target at a predetermined position;
• an abutment step of preparing a metalens having a first surface and a second surface opposing each other and causing the metalens to abut on the semiconductor device such that the first surface faces the semiconductor device;
• and
• a fault analysis step of executing fault analysis of the semiconductor device by observing the semiconductor device by using the metalens,
• wherein the metalens prepared in the abutment step comprises:
• a base portion provided between the first surface and the second surface opposing to the first surface;
• a plurality of first antennas provided between the first surface and the base portion, the plurality of first antennas each having a first refractive index and a first-antenna end surface constituting a part of the first surface;
• and
• a first intermediate portion provided between the first surface and the base portion such that a part is positioned between the plurality of first antennas, the first intermediate portion having a second refractive index different from the first refractive index and a first-intermediate-portion end surface constituting a remaining part of the first surface, and
• wherein a first antenna portion constituted by the plurality of first antennas and the first intermediate portion is formed such that a one-dimensional arrangement constituted by the first-antenna end surfaces of which centers of gravity are positioned on at least one first reference line on the first surface among the first-antenna end surfaces of the plurality of first antennas includes an arrangement pattern in which at least one of a size of the first antenna-end surface, a shape of the first-antenna end surface, and a first arrangement pitch is changed along the first reference line.