Through-silicon via detecting circuit, detecting methods and integrated circuit thereof

A TSV detecting method, comprising:

• transmitting, according to a first clock signal, an input signal to a first input unit and further to a first input of a first comparison unit, wherein the TSV detecting circuit comprises a first detecting module and a second detecting module, the first detecting module comprises the first input unit, a first switching unit, and the first comparison unit, and the first switching unit is configured to transmit a signal of a first node coupled to a first terminal of a TSV to a second input of the first comparison unit under a control of a first detection control signal;
• transmitting, by the TSV detecting circuit, according to a second clock signal, the input signal to a second input unit and further to a second node, wherein the second detecting module comprises the second input unit and a second switching unit, and the second switching unit is configured to transmit a signal of the second node to a second terminal of the TSV under a control of a second detection control signal;
• turning on the first switching unit by the first detection control signal and turning on the second switching unit by the second detection control signal, and transmitting the input signal to the second input of the first comparison unit through the second switching unit, the TSV, and the first switching unit;
• and
• comparing, by the TSV detecting circuit, signals input into the first input and the second input of the first comparison unit, and outputting a comparison result.