Slip-plane mems probe for high-density and fine pitch interconnects
AssigneeIntel Corporation
InventorsJoe Walczyk, Pooya Tadayon
Life of this patent
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Abstract
A device probe includes a primary probe arm and a subsequent probe arm with a slip plane spacing between the primary probe arm and subsequent probe arm. Each probe arm is integrally part of a probe base that is attachable to a probe card. During probe use on a semiconductive device or a semiconductor device package substrate, overtravel of the probe tip allows the primary and subsequent probe arms to deflect, while sufficient resistance to deflection creates a useful contact with an electrical structure such as an electrical bump or a bond pad.
Claims20
An electrical test prober, comprising:
- a probe card;
- and
- a probe, wherein the probe comprises:
- a probe base comprising a first end affixed to the probe card;
- a first arm cantilevered from a first portion of the probe base proximal to a second end of the probe base, opposite the first end;
- a probe tip at a free end of the first arm, the probe tip to contact a device under test (DUT);
- and
- a second arm cantilevered from a second portion of the probe base, wherein the second arm is between the first portion of the base and the first end.
An electrical test probe, comprising:
- a probe base comprising a first end to be affixed to a surface of a probe card;
- a first arm cantilevered from a first portion of the probe base proximal to a second end of the probe base, opposite the first end;
- a probe tip at a free end of the first arm, the probe tip to contact a device under test (DUT);
- and
- a second arm cantilevered from a second portion of the probe base, wherein the second arm is between the first portion of the base and the first end.
Dependencies are inferred from the claim text.