Mems pressure sensor and method for forming the same
AssigneeMemsen Electronics Inc
InventorManhing CHAU
Life of this patent
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AssigneeMemsen Electronics Inc
InventorManhing CHAU
Estimating the term…
Provided are a MEMS pressure sensor and a method for forming the same. The method includes: preparing a first substrate including a first surface and a second surface opposite to each other; preparing a second substrate including a third surface and a fourth surface opposite to each other; bonding the first surface and the third surface with each other and forming a cavity between the first substrate and the pressure sensing region of the second substrate; thinning the second substrate from the fourth surface by partially removing the second base, to form a fifth surface opposite to the third surface; and forming a first conductive plug passing through the second substrate from the side of the fifth surface of the second substrate to the at least one conductive layer.
A method for forming a Micro-Electro Mechanical System (MEMS) pressure sensor, comprising:
A Micro-Electro Mechanical System (MEMS) pressure sensor, comprising:
21-56. (Canceled)
Dependencies are inferred from the claim text.