Semiconductor device and semiconductor module

A semiconductor device comprising:

• a first lead frame;
• a first semiconductor chip bonded to the first lead frame;
• a second lead frame;
• a second semiconductor chip bonded to the second lead frame;
• and
• an inductor chip mounted on the second lead frame, the inductor chip being placed between the first semiconductor chip and the second semiconductor chip in plan view,
• wherein the inductor chip comprises:
• a substrate;
• a lower side inductor wiring formed over the substrate;
• an upper side metal wiring layer formed over the lower side inductor wiring in sectional view, the upper side metal wiring layer including inner metal wirings disposed relative to each other with even pitches and an outermost peripheral metal wiring surrounding the lower side inductor wiring and the inner metal wirings in a plan view, wherein a distance between the adjacent wirings forming the inner metal wirings being less than a distance between the outermost peripheral metal wiring and an outermost wiring of the inner metal wirings, and the outermost peripheral metal wiring is not in direct contact with the substrate;
• a first insulating material formed over the substrate, the lower side inductor wiring formed within the first insulating material, the outermost peripheral metal wiring being electrically isolated from the substrate by the first insulating material;
• an electrode pad formed on the outside the lower side inductor wiring in a plan view, the electrode pad capable of applying an electric potential to the lower side inductor wiring;
• a contact portion formed near a central part of the lower side inductor wiring such that the contact portion is in contact with the lower side inductor wiring, the electric potential from the electrode pad being applied to the lower side inductor wiring through the contact portion;
• and
• wherein the outermost wiring of the inner metal wirings is apart from the outermost peripheral metal wiring such that a distance is constant between the outermost wiring and the outermost peripheral metal wiring at a whole part of the outermost wiring having a curvature.