Overmolded optical circuits
AssigneeTE Connectivity Services GmbH
InventorsDwight David Zitsch, Megan Beers, Henry Burton Piper, III, Aakriti Kharel
Life of this patent
Estimating the term…
Loading patent…
AssigneeTE Connectivity Services GmbH
InventorsDwight David Zitsch, Megan Beers, Henry Burton Piper, III, Aakriti Kharel
Estimating the term…
A method of preparing an overmolded optical fiber assembly comprising: (a) placing at least one flexible optical circuit in a bottom mold, said bottom mold defining a bottom overmold cavity having a bottom surface, said at least one flexible optical circuit having a substrate and a plurality of fibers adhered to said substrate, said substrate being disposed within said bottom overmold cavity to define a first space between said substrate and said bottom surface; (b) flowing a polymer in at least said first space; (c) placing a top mold over said substrate, said top mold defining a top overmold cavity and a top surface and a port defined in said top surface to access said top overmold cavity, said substrate defining a second space between said top surface and said substrate; (d) flowing a polymer in at least a portion of said second space; and (e) removing said bottom and top molds to release said overmolded optical circuit.
A method of preparing an overmolded optical fiber assembly comprising:
The method of claim 14, wherein said fluoropolymer is at least one of CF1-3510, SIFEL 2614, SIFEL 3405, and SIFEL 3590-N.
The method of claim 19, wherein said polymer in said first space is precured before step (a).
Dependencies are inferred from the claim text.