Polishing apparatus using neural network for monitoring
AssigneeApplied Materials, Inc.
InventorsKun Xu, Hassan G. Iravani, Denis Ivanov, Boguslaw A. Swedek, Shih-Haur Shen, Harry Q. Lee, Benjamin Cherian
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AssigneeApplied Materials, Inc.
InventorsKun Xu, Hassan G. Iravani, Denis Ivanov, Boguslaw A. Swedek, Shih-Haur Shen, Harry Q. Lee, Benjamin Cherian
Estimating the term…
A method of polishing a layer on the substrate at a polishing station includes the actions of monitoring the layer during polishing at the polishing station with an in-situ monitoring system to generate a plurality of measured signals for a plurality of different locations on the layer; generating, for each location of the plurality of different locations, an estimated measure of thickness of the location, the generating including processing the plurality of measured signals through a neural network; and at least one of detecting a polishing endpoint or modifying a polishing parameter based on each estimated measure of thickness.
A method of polishing a substrate, comprising:
A polishing system, comprising:
A computer storage medium encoded with instructions that, when executed by one or more computers, cause the one or more computers to perform operations comprising:
Dependencies are inferred from the claim text.