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US 2021/0229024 A1Published application
Enhanced refrigeration purge system
AssigneeCarrier Corporation
InventorsRajiv Ranjan, Yinshan Feng, Parmesh Verma
Life of this patent
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Abstract
A heat pump includes a vapor compression system and a cooling unit thermally coupled to the vapor compression system. A purge system is arranged in fluid communication with the vapor compression system. The purge system includes at least one separator operable to separate contaminants from a refrigerant purge gas provided to the purge system from the vapor compression system.
Claims16
A heat pump comprising:
- a vapor compression system;
- a cooling unit thermally coupled to the vapor compression system;
- and
- a purge system in fluid communication with the vapor compression system, the purge system including at least one separator operable to separate contaminants from a refrigerant purge gas provided to the purge system from the vapor compression system.
1 more element
Dependencies are inferred from the claim text.