Package, light-emitting device, and laser device
AssigneesNichia Corporation, Shinko Electric Industries Co., Ltd.
InventorsHidenori MATSUO, Masaki OMORI, Wataru KATAYAMA, Ryota MITSUI
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AssigneesNichia Corporation, Shinko Electric Industries Co., Ltd.
InventorsHidenori MATSUO, Masaki OMORI, Wataru KATAYAMA, Ryota MITSUI
Estimating the term…
A package for at least one laser diode includes: leads configured to be electrically connected to the at least one laser diode; a base including a mounting surface on which the at least one laser diode is to be mounted and a lateral wall located around the mounting surface so as to surround the at least one laser diode, the lateral wall defining first through-holes and including a light-transmissive part configured to transmit a laser beam emitted from the at least one laser diode; and a lead holding member bonded to the lateral wall of the base and defining second through-holes. The leads are disposed through the first through-holes and the second through-holes. At least a central portion of each of the leads is made of copper.
A package for at least one laser diode, the package comprising:
Dependencies are inferred from the claim text.